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Technical Insights


Monday 4th July 2016
By forming an intermediate band, dilute nitrides promise to propel single-junction solar cell efficiency to new highs
Tuesday 28th June 2016
To produce the best PIC, is it better to take an InP laser and unite it with a silicon photonic chip, or make many components in InP, before uniting with silicon?
Tuesday 28th June 2016
Transfer printing of silicon onto InGaAs creates a multi-band detector for visible and infrared imaging
Friday 24th June 2016
Mapping a carrier’s emissivity and temperature profile exposes microcracks and emissivity variations that can directly impact thin-film deposition and device performance
Friday 24th June 2016
While the majority of CS shares head south, Oclaro’s are bucking the trend and soaring
Thursday 16th June 2016
Yellow and orange sources result from the controlled annealing of phosphide material systems with a dielectric cap
Tuesday 14th June 2016
Does InGaAs have the right set of attributes for maintaining the march of Moore’s Law?
Monday 13th June 2016
A lack of standards for 5G is threatening a move to faster data rates for mobiles, and could also hinder the growth of the internet-of-things and machine-to-machine communication
Monday 13th June 2016
High power, high efficiency UV emitters could result from the efficient tunneling injection of holes
Friday 3rd June 2016
Analysts at CS International claimed that 5G will be good for GaAs, opportunities in the infrared can diversify LED sales, and space applications are dominating shipments of multi-junction cells
Wednesday 1st June 2016
Can quantum dot lasers open up new possibilities for silicon photonics? Rebecca Pool looks at the work of Huiyun Liu and his team at University College London to track some of the discoveries being made in the lab.
Wednesday 1st June 2016
Photonic integration brings significant advantages in performance, environmental endurance and reliability. Rolf Evenblij, Program Manager at Technobis Fibre Technologies, looks at the key components enabling the detection of extremely small variations in temperature, vibration (and other parameters) for monitoring applications in aerospace, energy and nuclear industries, semiconductor and medical sectors.
Friday 20th May 2016
As device geometries continue to shrink, semiconductor packaging technologies face constant challenges to remain relevant and economically viable. Need of the hour is to develop innovative approaches that cost-effectively address the emerging requirements.
Friday 20th May 2016
MOCVD reactors that deliver fast production of aluminium-rich epiwafers with carefully controlled doping profiles can drive a growth in shipments of UV LEDs and vertical power devices
Thursday 12th May 2016
Are the higher efficiencies and speeds required by 5G destined to play into the hands of compound semiconductor chipmakers? 
Thursday 5th May 2016
Following frustrating trials, chipmakers are failing to fully appreciating the disruptive potential of GaN-on-silicon LEDs. 
Wednesday 27th April 2016
Nothing surpasses gold’s inherent semiconductor performance benefits, but ClassOne Technology explains how its electroplating system can keep performance high at a fraction of the cost.
Wednesday 27th April 2016
Readying extreme ultraviolet lithography (EUVL) for high volume manufacturing has presented many challenges along the road to creating next-generation semiconductors. Imec researchers believe they are a step closer in delivering a much needed pellicle solution.
Wednesday 27th April 2016
Manufacturing consolidations have led to industry-wide change. When fabs open or close, relocating valuable process tools is a key consideration. As specialist NSTAR explains, making a move productive and efficient takes a trusted partner.
Wednesday 27th April 2016
Reducing cost in semiconductor manufacturing is a constant way of life and reducing cost of consumables (CoC) is just one of many ways in which the industry can become more competitive and hence, more profitable.
Wednesday 27th April 2016
With 3D integrated circuit wafer stacking entering mainstream HVM, backside processing has become a more critical step for device manufacturers. A study commissioned by Veeco Instruments points to clear advantages of wet etch processing. By Mark Andrews, technical contributor, Silicon Semiconductor.
Wednesday 27th April 2016
Atomic Force Microscopy (AFM) leader Park Systems has simplified 300mm silicon wafer defect review by automating the process of obtaining high-resolution 3D images, making it faster and simpler than ever before.
Wednesday 27th April 2016
Global semiconductor companies met in Grenoble, France for SEMICON Europa 25-27 October in a bid to shake off the doldrums that had stymied growth for nearly two years. While positive reports encouraged attendees, most companies are looking to Internet of Things (IoT) products to move the needle most in 2017.
Wednesday 27th April 2016
Plastic encapsulated microcircuits (PEMs) are mainstays of consumer, defence and commercial electronic products. Tom Adams, consultant at Sonoscan, explains how to safeguard your bottom line with optimized acoustic screening.

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