< Page >

Features


Thursday 5th May 2016
Following frustrating trials, chipmakers are failing to fully appreciating the disruptive potential of GaN-on-silicon LEDs. 
Wednesday 27th April 2016
Nothing surpasses gold’s inherent semiconductor performance benefits, but ClassOne Technology explains how its electroplating system can keep performance high at a fraction of the cost.
Wednesday 27th April 2016
Readying extreme ultraviolet lithography (EUVL) for high volume manufacturing has presented many challenges along the road to creating next-generation semiconductors. Imec researchers believe they are a step closer in delivering a much needed pellicle solution.
Wednesday 27th April 2016
Manufacturing consolidations have led to industry-wide change. When fabs open or close, relocating valuable process tools is a key consideration. As specialist NSTAR explains, making a move productive and efficient takes a trusted partner.
Wednesday 27th April 2016
Reducing cost in semiconductor manufacturing is a constant way of life and reducing cost of consumables (CoC) is just one of many ways in which the industry can become more competitive and hence, more profitable.
Wednesday 27th April 2016
With 3D integrated circuit wafer stacking entering mainstream HVM, backside processing has become a more critical step for device manufacturers. A study commissioned by Veeco Instruments points to clear advantages of wet etch processing. By Mark Andrews, technical contributor, Silicon Semiconductor.
Info
Wednesday 27th April 2016
Atomic Force Microscopy (AFM) leader Park Systems has simplified 300mm silicon wafer defect review by automating the process of obtaining high-resolution 3D images, making it faster and simpler than ever before.
Wednesday 27th April 2016
Global semiconductor companies met in Grenoble, France for SEMICON Europa 25-27 October in a bid to shake off the doldrums that had stymied growth for nearly two years. While positive reports encouraged attendees, most companies are looking to Internet of Things (IoT) products to move the needle most in 2017.
Wednesday 27th April 2016
Plastic encapsulated microcircuits (PEMs) are mainstays of consumer, defence and commercial electronic products. Tom Adams, consultant at Sonoscan, explains how to safeguard your bottom line with optimized acoustic screening.
Wednesday 27th April 2016
"Run-to-Run control can significantly improve process performance, but often at considerable time and cost. Taking a higher level view that applies novel methodologies can increase performance and savings with minimal metrology burdens." Says Joerg Reichelt, Yulei Sun – Rudolph Technologies, Inc. Tilo Bormann, Andreas Gondorf – Vishay Siliconix Itzehoe GmbH.
Friday 22nd April 2016
Designing power conversion systems with fewer, higher-voltage MOSFETs cuts component count, increases reliability and has little impact on the total area of the chips
Friday 22nd April 2016
Drain engineering increases the operating voltage of GaN HEMTs, enabling them to combine unprecedented power, gain and efficiency with great reliability
Info
Friday 22nd April 2016
Combining molybdenum disulphide channels with graphene electrodes creates high-performance transistors that consume very little power.
Tuesday 12th April 2016
Removing thermal boundaries and adding thermal pathways help devices to keep their cool
Monday 4th April 2016
The Chinese LED industry is changing. A multitude of rivals is giving way to a smaller number of larger and ever-expanding LED chipmakers that are targeting growth of domestic and overseas sales, says IHS analyst Alice Tao during a wide-ranging interview with Richard Stevenson.
Monday 4th April 2016
The attributes of white LEDs are not limited to high efficiencies and long lifetimes. Scale them down, arrange them in arrays and equip them with fast-responding colour converters, and these devices are very promising broadband sources for high speed, light-based wireless communicationBY JONATHAN MCKENDRY FROM THE UNIVERSITY OF STRATHCLYDE
Wednesday 30th March 2016
The planned merger of CS Clean Systems and Centrotherm Clean Solutions creates a single-source vendor offering a full suite of exhaust gas abatement products
Wednesday 30th March 2016
Wafer-level, chip scale packaging using 200 mm silicon substrates improves wavelength uniformity, reduces thermal droop, aids radiative efficiency and slashes LED production costsBY HYUN KUM, JOOSUNG KIM, YONGJO TAK, JONGSUN MAENG, JUN-YOUN KIM AND YOUNGSOO PARK FROM SAMSUNG ELECTRONICS
Info
Tuesday 29th March 2016
Defect-trapping pockets enable the growth of high-quality films of GaAs on large-area, conventional silicon substrates 
Tuesday 29th March 2016
Tunnel FETs are the post-CMOS solution, thanks to their ability to deliver great performance while consuming very little power 
Tuesday 22nd March 2016
Introducing new channel materials lays the groundwork for slashing the power consumption per transistor
Tuesday 22nd March 2016
A vertical architecture holds the key to producing rugged transistors with a small footprint and a very high operating voltage
Thursday 17th March 2016
To maintain the march of Moore’s law, silicon foundries may introduce germanium and III-V nanowire FETs at the 5 nm node
Monday 14th March 2016
Highly uniform metal alloys of precise stoichiometry result from an optimally placed and replenished source in an electron-beam evaporator

×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
Live Event