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Features


Tuesday 4th May 2004
Although GaAs continues to dominate in cellular PAs, several suppliers hope that their new products designed in SiGe and CMOS may soon start to appear in handsets. Tim Whitaker reports.
Tuesday 4th May 2004
With a glut of GaAs capacity still in place, how can pure-play GaAs foundries survive and be profitable? Not easily, in the view of some senior industry figures. Michael Hatcher catches up with WIN Semiconductor and reports on what some see as a flawed business model.
Tuesday 4th May 2004
As the market-share leader in cellular power amplifiers, RF Micro Devices continues to implement new technologies and introduce smaller and more highly integrated products. The company is now set to potentially double its dollar content within each handset by moving into the GSM/GPRS transceiver market. Compound Semiconductor spoke with Jerry Neal, RFMD co-founder and executive vice-president of marketing and strategic development.
Tuesday 6th April 2004
Buoyant sales of DVD players and recorders in 2003 more than offset the third consecutive annual drop in sales to telecom applications as the laser diode market grew for the first time since 2000. Figures show that optical data storage is now dominating the laser diode market more than ever.
Tuesday 6th April 2004
At the annual OFC conference in late February, members of a mildly optimistic fiber-optic industry gathered in Los Angeles to discuss the latest developments in what could be the start of a recovery for the depressed sector. Michael Hatcher reports.
Tuesday 6th April 2004
A unique combination of self-organized quantum dot structures, an AlAs-GaAs material system and a defect-reduction technique promises to deliver dramatic advantages for GaAs-based devices in both optoelectronic and microelectronic applications, writes Nikolai Ledentsov.
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Tuesday 6th April 2004
As mobile phone handsets continue to be the key driver behind growth in HB-LED manufacturing, Michael Hatcher reports from the Strategies in Light conference on a serious ramp-up of production capacity in Asia, "kilolumen" sources and the development of LED headlamps.
Tuesday 6th April 2004
For Matsushita Electric Industrial, recordable DVD is set to be huge this year, while a next-generation DVD recorder based on a GaN laser is scheduled for July. Meanwhile, the company is refocusing its GaAs MMIC production on the global market. Bob Johnstone reports from company HQ in Kyoto.
Monday 15th March 2004
Lighting designers are eager to increase their adoption of LED technology, but are looking for device suppliers to remove some of the hurdles, writes Tim Whitaker.
Monday 15th March 2004
Based on manipulating the spin - rather than the charge - of electrons, spintronics could one day provide us with faster, more efficient devices, as Jon Newey discovers.
Monday 15th March 2004
Last year, Bookham Technology transferred one of the world's most advanced InP fabs from Ottawa, Canada, to Caswell, the former Marconi facility in the heart of the English countryside. Michael Hatcher visited Caswell to check up on Bookham's progress.
Monday 15th March 2004
Last month, we looked at laser scribing for back-end wafer processing. Here, we ask James Loomis of Loomis Industries about the technological advantages of diamond scribe dicing.
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Monday 15th March 2004
Martin Murtagh, Pat Kelly and Roy Blunt report on a novel approach to photoreflectance spectroscopy that measures both cavity-mode and quantum well transition energies, promising to improve the quality assurance of VCSEL epiwafers and reduce the need for destructive testing.
Tuesday 10th February 2004
We've analyzed some of the emerging technologies and markets that will shape 2004, including recordable DVD, wireless LAN and wide-bandgap microelectronics. First, Michael Hatcher discusses the trends that will affect the overall compound semiconductor market.
Tuesday 10th February 2004
Sales of GaAs ICs for WLAN applications grew by 140% in 2003 according to one estimate. Tim Whitaker talks to the major players in what is fast becoming a key market for compound semiconductors.
Tuesday 10th February 2004
3G base stations are finally appearing on the cellular infrastructure scene. But can high-power GaN devices grab a foothold in the market this year? Jon Newey investigates.
Tuesday 10th February 2004
With tire manufacturer Bridgestone joining the flock of companies developing SiC devices, what technological developments can we expect to see this year? Jon Newey reports.
Tuesday 10th February 2004
Set up to develop super-fast InAs-based devices, DARPA's antimonides program could open up a whole new range of applications where low power consumption is desired. Tim Whitaker reports.
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Tuesday 10th February 2004
Having carved out a niche in back-end processing of sapphire and SiC wafers over the past couple of years, some laser tool manufacturers are now targeting GaAs and InP wafers. Meanwhile, others believe that these material systems will remain the preserve of diamond scribe tools and saws.
Tuesday 10th February 2004
The 2003 IEEE International Electron Devices Meeting in Washington, DC, featured record-breaking performances in the field of BiCMOS and the first wide-channel strained-silicon devices.
Monday 5th January 2004
As chip manufacturers continue to improve the performance and reduce the cost of their products, new applications in areas such as airport lighting and car headlamps continue to emerge. Tim Whitaker reports from the Intertech LEDs conference.
Monday 5th January 2004
Growth in the high-brightness LED market will be fueled increasingly by illumination applications over the next five years as the price/performance characteristics of devices improve. Bob Steele of Strategies Unlimited analyzes the development of the solid-state lighting marketplace.
Monday 5th January 2004
It is widely believed that general lighting will one day become a huge market for white-light LEDs. Bill Kennedy describes some of Toyoda Gosei Optoelectronics' recent technological progress.
Monday 5th January 2004
Donald Huo and colleagues from Epistar Corporation describe a new mirror adhesion technique for producing high-brightness and high-power AlGaInP LED chips.

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