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Features


Monday 7th October 2013
Today's telecom lasers are plagued with Auger-related losses, which drive down efficiency and make device cooling mandatory. The solution: Switch to an active region with alloys featuring a bismuth content of more than 10 percent, claim members of the European team BIANCHO.
Friday 4th October 2013
Lux Research recently reported which up and coming solar technologies will succeed. Compound Semiconductor talks to analyst Fatima Toor to find out more.
Thursday 3rd October 2013
A novel, water-based stripper offers a fast, environmentally friendly approach to high quality removal of photoresist and the carrying out of metal lift-off, claims Dirk Schumann from Bubbles & Beyond.
Monday 30th September 2013
In-situ monitoring provides a great deal of valuable information for developers and producers of multi-junction solar cells. It can determine interface quality; the thickness, doping level and composition of every layer; and wafer bow, says Oliver Schulz from LayTec.
Friday 27th September 2013
Belgium and Japan-based researchers unveil an improved process to integrate germanium-tin layers and MOSFETs on silicon substrates. Compound Semiconductor reports
Thursday 26th September 2013
The gases and chemicals that are consumed during the manufacturing of LEDs make a considerable contribution to device costs. But savings are possible by switching to a new MOCVD design with a flared chamber profile. This not only trims gas consumption by up to 40 percent but also shortens the growth interruption between layers, leading to improved multiple quantum well quality, say Frank Campanale, Mike Begarney and Tom Ryan from Valence Process Equipment.
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Friday 20th September 2013
Once intent on lighting up the LED industry with its novel process to fabricate nano-rod LEDs, Seren Photonics is now focusing on large semi-polar GaN templates for a brighter light. Compound Semiconductor reports.
Monday 16th September 2013
Conventional sensors for assessing the air quality in buildings are wired into the mains, making them expensive to install and reposition. But portability and battery powering is possible with Gas Sensing Solutions� modules that feature mid-infrared LEDs and photodetectors. Richard Stevenson reports.
Tuesday 10th September 2013
Inferior light quality holds back the sales of most LEDbased replacements for halogen lamps in casinos, hotels, high-end retailers and cruise ships. But that’s not the case for Soraa’s lighting products, which produce full-spectrum emission with a violet LED pumping red, green and blue phosphors. Richard Stevenson reports.
Thursday 29th August 2013
Lasers from the lab hit up to 250 mW in the green and 4W in the blue
Tuesday 27th August 2013
Engineers at Samsung and Osram claim that LEDs grown on silicon can deliver a performance that is very close to that of today's emitters grown on sapphire
Monday 19th August 2013
Cutting cell costs will ensure that concentrating photovoltaic systems become more competitive. One way to do this is to turn to silicon substrates incorporating germanium-based layers, which bridge lattice constants and allow the formation of a 1 eV junction for boosting efficiency, say Andrew Clark, David Williams and Radek Roucka from Translucent.
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Thursday 15th August 2013
Telecom and datacom networks are under ever-increasing strain from an explosion in data transfer. What's the long-term solution? It's a universal photonics technology that marries InP performance with large silicon wafers, argue Daniel Sparacin and Greg Fish from Aurrion.
Tuesday 13th August 2013
The US Department of Defense views GaN MMICs as too expensive and insufficiently reliable for its needs. To address these shortcomings, it is spearheading a project to drive down cycle times, increase yield and improve reliability. Richard Stevenson reports.
Thursday 8th August 2013
Come 2020, US analyst business, Lux Research, predicts sapphire-based LEDs will still dominate a multi-billion dollar LED lighting industry. Compound Semiconductor finds out why.
Wednesday 7th August 2013
Rumours are circulating that reserves of indium could soon run out, threatening the production of displays, LEDs, and lasers. But if you take a hard look at the evidence, you’ll find that the naysayers are ill-informed and there is plenty indium to go round for many decades, argues Malcolm Harrower from Indium Corporation.
Monday 29th July 2013
Engineers can build motor drives and power supplies that deliver very high levels of efficiency by combining frugal, fast SiC Super Junction Transistors with optimised gate drivers, argues Ranbir Singh from GeneSiC Semiconductor.
Friday 26th July 2013
As Plessey Semiconductor scales up commercial GaN on silicon LED production, where next for the UK technology pioneer, asks Compound Semiconductor.
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Friday 26th July 2013
It is difficult to gauge the state of the concentrating photovoltaic (CPV) industry: Amongst system manufacturers, GreenVolts has folded and Amonix scaled back, but Soitec has announced big, bold plans. Although this indicates that life can be tough in the CPV industry, the sector should grow at a healthy rate according to research manager Sam Wilkinson from IHS, who has been talking to Richard Stevenson about the current state and prospects for this technology.
Friday 12th July 2013
Infinera is storming long-haul fibre optic markets with its InP-based WDM platform. Compound Semiconductor finds out how.
Wednesday 10th July 2013
Covering a graphene contact with a thin layer of nickel allows the performance of an ultraviolet LED built with this upper electrode to get close to that of a conventional device
Tuesday 9th July 2013
Modified active region trims electric fields, increases electron-hole overlap and boosts brightness
Monday 8th July 2013
Conventional imaging techniques, such as various forms of electron microscopy, are incapable of delivering three-dimensional atomic resolution that can offer new insights into the characteristics of GaN-based heterostructures. But this type of measurement is possible with atom probe tomography, say Baishakhi Mazumder, Man Hoi Wong, Jack Zhang, Stephen Kaun, Jing Lu, Umesh Mishra and James Speck from the University of California, Santa Barbara.
Friday 5th July 2013
Investors in deposition equipment want tools that have really high levels of up time, deliver incredibly uniform films and offer an upgrade path that will prevent them from becoming obsolete within a few years. To meet these requirements, it is essential that the equipment vendor and chipmaker work together to improve the deposition system and its process, argue Robert Mohondro from Plasma-Therm and Evan Law and Jim Meyer from RF Micro Devices.

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