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Company News


Wednesday 30th November 2011
The addition of former executives from First Solar and Intel emphasises MiaSolé’s commitment to strategic growth and industry advancement.
Tuesday 29th November 2011
The firm says its latest Oslon Square LEDs make even better use of light.
Friday 25th November 2011
TIME magazine has honoured Ascent Solar Technologies flexible CIGS panels with one of its "50 Best Inventions of 2011" awards
Friday 25th November 2011
Patents infringed upon are used to produce homogeneous light used in white LEDs.
Thursday 24th November 2011
M/A-COM Technology Solutions, a supplier of high performance analog semiconductor solutions, announced today that it has honoured WIN Semiconductors Corporation with its Foundry Supplier of the Year Award for 2011.
Thursday 24th November 2011
Integration of multiple optical functionalities on a single chip is now a principal direction for industry growth and development in optics and photonics.
Thursday 24th November 2011
JUSUNG Engineering Co. Ltd, a manufacturer of semiconductor, display and solar cell technologies, released a pioneering deposition technology that enables flat panel display makers to dramatically enhance high definition resolution in the next generation displays.
Thursday 24th November 2011
Government funding of £3 million will back seven industry-led, innovative, research and development projects that will demonstrate materials to support the development of tomorrow’s energy technologies.
Thursday 24th November 2011
RFMD’s new RF1604D is a single-pole four-throw (SP4T) switch designed for Receive Diversity switching applications.
Monday 21st November 2011
Industrial applications present reliability challenges to designers as a result of the high temperature and tight spaces commonly found in power supplies, motor controls and consumer applications such as chargers and adapters.
Friday 18th November 2011
The firm’s spectrometers, which can be used to analyse LEDs and solar cells, can now be controlled and data acquisition conditions altered through a gigabit Ethernet connection.
Thursday 17th November 2011
The DFB-LD, which incorporates an aluminium indium gallium arsenide active layer and the APD featuring an aluminium indium arsenide (AlInAs) multiplication layer will contribute to simpler networks and faster broadband service.
Thursday 17th November 2011
The firm says its latest transponders leverage its history in delivering coherent solutions, its competencies in indium phosphide and lithium niobate (LiNbO3) material technologies, its vertical integration in optical components, and its production and application expertise.
Wednesday 16th November 2011
Addressing the needs of researchers operating in the UHV/XHV vacuum regime, the firm’s latest tools are specialised for fast-event gaseous studies at pressures to atmosphere and beyond.
Tuesday 15th November 2011
The publication considers the main applications and advantages of using ion beam etch technology for etching processes when compared to technologies such as plasma etching.
Tuesday 15th November 2011
MMD Newswire says that over the past 12 months, over 220 thousand shares of Veeco Instruments Inc. stock were sold by insiders, totalling over $11.2 million, but that no shares have been purchased by insiders over the same time frame.
Tuesday 15th November 2011
Terrence Gallagher, will take over the positions of Vice President and Chief Financial Officer and hopes to help the business return to profitability.
Tuesday 15th November 2011
The firm’s HVC-170X modules have received ANSI/UL-1703, IEC-61646, and IEC-61730 certifications, as tested and certified by Intertek-ETL.
Tuesday 15th November 2011
The firm will showcase its latest technologies, many of which incorporate III-V VCSELs, at the Supercomputing 2011 conference this week in Seattle.
Monday 14th November 2011
The RFAM2790 is an integrated amplifier and employs a gallium arsenide pHEMT die, a GaAs MESFET die, a 20dB range variable attenuator, and a power enable feature.
Monday 14th November 2011
The fully automated tool is available in 532, 785, 1064nm or custom wavelengths and can be used to characterise compound semiconductor materials.
Monday 14th November 2011
The provider of compound semiconductor-based components has gone into volume production of its fibre optic cables for use in high-performance computing, ethernet router and switch applications.
Monday 14th November 2011
The firm’s latest MiniPOD and MicroPOD embedded interconnects are connectivity solutions that enable cloud computing and virtual server applications.
Monday 14th November 2011
The firm’s indium gallium phosphide HBT technology is used in the 3G/4G chipsets which also use TriQuint’s patented CuFlip technology. This flip chip interconnect technique uses copper ‘bumps' to replace wire bonds.