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Company News


Tuesday 25th June 2013
The firm's InP (indium phosphide) technology based PICs were named
Tuesday 25th June 2013
The firm is to withdraw from the magnetics sector due to EU legislation which is expected to come into force from 2017
Monday 24th June 2013
The firm will now concentrate its efforts on gallium arsenide (GaAs) based integrated opto-electronic circuits
Monday 24th June 2013
Using MBE or MOCVD equipment, NASA Langley is seeking a facility for III-V semiconductor epilayer growth
Thursday 20th June 2013
The firm believes its latest enhancment mode gallium nitride transistor demonstrates size reduction and efficiency enhancement for power conversion with high frequency switching
Thursday 20th June 2013
The compact Pemtron SEM systems have been designed to bridge the gap between tabletop and full size tungsten SEMs
Thursday 20th June 2013
The firm's III-nitride LEDs have been awarded by automotive supplier, Yazaki North and Central America
Wednesday 19th June 2013
In large-area exposure mode, the system can be used for surface annealing applications of semiconductors
Tuesday 18th June 2013
The firm's III-nitride MicroSideled 3806 offers 15,000 hours of constant output for portable device displays
Tuesday 18th June 2013
The III-V semiconductor equipment provider has received stay of suspension pending a NASDAQ hearing
Tuesday 18th June 2013
The LED innovator in quantum dot down-converters for solid state lighting and displays has taken on a new board member
Monday 17th June 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, today introduced CoatsClean™-an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets. EVG state CoatsClean provides a complete wafer cleaning solution that offers efficiency, performance and cost-of-ownership (CoO) advantages compared to traditional resist stripping and post-etch residue removal methods.
Friday 14th June 2013
Anadigics’ compact indium gallium phosphide Pentaband device features high performance power amplifier chains. These enable operation in 21 different 3G and 4G frequency bands and band classes
Friday 14th June 2013
Thin film processes & materials for FEOL and interconnect applications will fuel the demand for the precursors
Friday 14th June 2013
GeneSiC believes its SiC (silicon carbide) 3300 V rating is a key differentiator for the high voltage generator market and will allow significant benefits
Thursday 13th June 2013
The firm is intending to expand from light and electron microscopy into X-ray microscopy solutions
Thursday 13th June 2013
The company is launching an intelligent based transport network to aid its indium phosphide (InP) based PIC customers
Thursday 13th June 2013
This acquisition will enable Luminus to have access to an advanced R&D operation in California as well as the overall technical strength of Sanan’s Corporate R&D Technical Centre
Thursday 13th June 2013
The companies are making a joint effort to enable a suite of products for security, monitoring and automation applications
Monday 10th June 2013
The supplier of III-V based chip-sets enables high speed optical interconnects in data centres for short and long reach high speed connectivity applications
Monday 10th June 2013
The SPIE awarded Siva Sivananthan for his contributions to the development of II-VI photovoltaic materials
Friday 7th June 2013
The device employs GaAs pHEMT technology and offers a low cost compact space-saving broadband solution
Thursday 6th June 2013
The gallium nitride devices are claimed to be about half the size of similar power amplifiers
Thursday 6th June 2013
The firm's gallium nitride device is targeted towards the military and commercial high-power amplifier markets