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Company News


Wednesday 21st May 2014
New SiC MOSFETs complemented with SiC power modules, significantly improving system efficiency in high-voltage applications and delivering maximum power efficiency to help customers develop lighter, smaller, more reliable system designs
Wednesday 21st May 2014
EMCORE a provider of compound semiconductor-based components and subsystems for the fiber optics and space solar power markets, have announced that it has expanded its recently launched DOCSIS 3.1 laser line with the release of the Model 1616A DOCSIS 3.1, 1310 nm DFB Laser Module for CATV (Cable Television) applications. The new 1616A laser module is compliant with the new DOCSIS 3.1 standard, supporting operational bandwidth up to 1.2 GHz
Wednesday 21st May 2014
Megasonic developer applies uniform acoustic energy to spinning substrates to gently dissolve and remove films and residues without damaging fragile device structures
Tuesday 20th May 2014
GaN Systems launches five new normally-off 100V GaN transistors in optimised low inductance and thermally-efficient packaging
Tuesday 20th May 2014
GaN Systems, a developer of gallium nitride power switching semiconductors, has announced five new normally-off 650V GaN transistors optimised for high speed system design.
Tuesday 20th May 2014
New SiC MOSFETs complemented with SiC power modules develop lighter, smaller, more reliable system designs
Tuesday 20th May 2014
Shanghai University Chooses AIXTRON for Graphene and Nanotube Processing
Tuesday 20th May 2014
TriQuint Semiconductor have announced the appointment of Upstar Technology as its new distributor in China for TriQuint high-performance mobile products.
Tuesday 20th May 2014
Rubicon Technology, a provider of sapphire substrates and products to the LED, semiconductor, and optical industries, has announced that the company will showcase its line of optical products for use in defence and aerospace, instrumentation and analytical processing, sensors and detectors, semiconductor process equipment, and medical and laser applications at Optatec, the international trade fair for optical technologies, components and systems, in Frankfurt Germany May 20-22, 2014 at Frankfurt Exhibition Centre in Hall 3, Stand H37.
Monday 19th May 2014
New bonder completes Brewer Science tool suite for low-volume production or R&D lab environments
Monday 19th May 2014
Plessey expands its distribution network in Europe with Alcom partnership for Benelux
Monday 19th May 2014
TriQuint Wins Chipset Reference Design to Deliver Gigabit Wi-Fi for Whole-Home HD Video Streaming & Other Demanding Multimedia Applications
Friday 16th May 2014
First member of Cree’s high-power CPW5 diode family to be released in packaged form
Friday 16th May 2014
SAMCO has announced the relocation of its U.S. East Coast regional office.
Thursday 15th May 2014
Mitsubishi Electric to Ship Sample Hybrid SiC Power Semiconductor Modules for High-frequency Switching Applications
Thursday 15th May 2014
Broadband and High Gain Low Noise Amplifiers Announced by Pasternack
Thursday 15th May 2014
All-SiC 300A, 1.2kV Half-Bridge Module Doubles Power Density and Enables Efficiencies up to 99 percent in Induction Heating, Central Solar Inverters and AFE Motor Drives
Thursday 15th May 2014
The GaN on GaN™ LED technology specialist, Soraa announced today that the company will launch and display a series of new full-visible-spectrum large LED lamps at LightFair International (June 3-5) in Las Vegas, NV. This new line of AR111, PAR30L (Long Neck), PAR30S (Short Neck), and PAR38 lamps complements the company’s MR16 lamp, creating a full line of products to perfectly and dramatically light restaurant, retail, hospitality, and residential applications.
Wednesday 14th May 2014
Transphorm have announced that it has obtained a sole worldwide license to Furukawa Electric Co., Ltd.'s Gallium Nitride power device portfolio that includes approximately 40 U.S. issued patents and 110 Japanese issued patents.
Wednesday 14th May 2014
Higher efficiency could allow RF designers flexibility to reduce amplifier size and weight, creating savings in operating and total lifecycle costs
Wednesday 14th May 2014
Element Six's GaN-on-Diamond Wafers Proven by Raytheon to Provide Three Times Improvement in Power Density Versus GaN-on-SiC for RF Devices
Tuesday 13th May 2014
Three new tiers of manufacturing quality substrates to optimize next-generation power electronic device designs
Tuesday 13th May 2014
Apex gas mixing system has been designed to reduce costs by allowing dilution at point of use