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Industry News


Thursday 15th October 2009
Tower Semiconductor and its subsidiary, Jazz Semiconductor have announced the availability of Deep-Silicon-Via (DSV) technology available in its 0.18-micron SiGe BiCMOS
Thursday 15th October 2009
ITRI and Applied Materials collaborate to advance 3D IC technology
Thursday 15th October 2009
Foundry IC sales are to grow at twice the rate of the overall IC industry.
Wednesday 14th October 2009
RF Micro Devices will host a conference call to review fiscal 2010 second quarter financial results on Tuesday, October 27, 2009, at 5:00 p.m. (ET).
Wednesday 14th October 2009
QuantaSol has exclusively licensed advanced materials growth technology from the University of Houston to make its manufacturing process simpler and cheaper, while further improving solar cell efficiency.
Wednesday 14th October 2009
CRAIC Technologies, an innovator of UVvisible- NIR microanalysis solutions for scientific laboratories, announces the Microspectra 10 UV-visible-NIR microscope spectrophotometer
Tuesday 13th October 2009
Sunovia Energy and partner EPIR Technologies have announced that they have fabricated single-junction and twojunction cadmium telluride (CdTe) based solar cells that have far surpassed the longstanding world record open circuit voltage (Voc) for thin film CdTe solar cells.
Tuesday 13th October 2009
3S PHOTONICS, the French manufacturer of optical and optoelectronic components for telecommunication networks, and leading supplier of ultra-high reliability components for undersea optical networks today announced that it will unveil its Next- Generation 1996 SGP Series 980nm submarine-grade pump modules.
Tuesday 13th October 2009
Oxford Instruments Plasma Technology (OIPT) has just received a 3 system order from the prestigious new Melbourne Centre for Nanofabrication (MCN) in Australia.
Tuesday 13th October 2009
Frost and Sullivan announce the top ten emerging technologies to invest in
Monday 12th October 2009
EV GROUP UNVEILS NEXT-GENERATION UV-NANOIMPRINT LITHOGRAPHY (UV-NIL)
Monday 12th October 2009
EV GROUP SECURES ORDER FOR 300-MM WAFER BONDER
Monday 12th October 2009
EV GROUP TO COLLABORATE WITH APPLIED MATERIALS ON THIN WAFER BONDING TECHNOLOGY FOR 3D IC DEVELOPMENT
Monday 12th October 2009
EV GROUP’S GEMINI WAFER BONDER SELECTED BY LEADING KOREAN RESEARCH CENTER AND FOUNDRY SERVICE PROVIDER RFID/USN FOR 3D MEMS MANUFACTURING
Monday 12th October 2009
Evatec and CORIAL create “Thin Film Powerhouse”
Monday 12th October 2009
“Autoload system” to increase wafer throughput and reach new heights in process yield.
Monday 12th October 2009
Dow Corning and AIXTRON AG today announced that Dow Corning is extending its SiC epitaxy capabilities with the latest generation AIXTRON Planetary Reactor platform AIX 2800G4 WW for 10x100 mm and future 6x150 mm SiC wafers. The reactor is planned to be commissioned in the second quarter 2010.
Monday 12th October 2009
Johnson Matthey, designer, manufacturer and distributer of highly reliable bulk and point-of-use hydrogen and nitrogen purifiers, recently shipped several palladium and getter purifiers that will enable further advancements in worldwide photovoltaic (PV) manufacturing.
Monday 12th October 2009
Yole Développement updated its new markets & technological study dedicated to silicon carbide industry.
Monday 12th October 2009
Bronkhorst High-Tech B.V. manufactures metal sealed mass flow meters/controllers, designed especially to meet the requirements of the semicon market as well as other high purity gas applications.
Saturday 10th October 2009
The EZ-ZONE® PM Express Panel Mount Controller from Watlow®
Saturday 10th October 2009
Watlow Introduces ULTRAMIC™ 600, an Advanced Ceramic Heater with an Exceptionally Fast Ramp Rate in a Small Durable Package
Saturday 10th October 2009
Foundry Agreement Drives ANADIGICS’ New Hybrid Manufacturing Strategy
Saturday 10th October 2009
ANADIGICS Expands Global Presence with New Tokyo, Japan Sales Office