Info
Info
search:

< Page of 13987 >

Industry News


Thursday 20th March 2014
The market analysts believe that the LED market will stick to GaN-on-sapphire
Thursday 20th March 2014
The manufacturer of compound semiconductor epitaxial wafers is increasing the ability to produce high volumes of 4-inch and 6-inch wafers for VCSELs, edge-emitting lasers, detectors and photovoltaics
Thursday 20th March 2014
The FluidJet metal liftoff system is claimed to eliminate device damage, while using 80 percent less chemical than current single wafer processing solutions
Wednesday 19th March 2014
The firm says its latest III-nitride based CoB LEDs offer twice the light from half the surface
Wednesday 19th March 2014
The high volume production of the wafers will be used in a variety of applications. These will include the mobile, defence and military, computing and medical sectors
Wednesday 19th March 2014
The SPECTOR-HT system is claimed to offer higher depostion rates than other tools
Wednesday 19th March 2014
The firm's total area efficiency cadmium-telluride module has been confirmed by NREL. This result is expected to expand the opportunity for constrained space and C&I installations
Wednesday 19th March 2014
The firms' combined expertise is aimed at improving PV plant production and reduce costs in 1500VDC applications
Tuesday 18th March 2014
The combination will increase defence market opportunities for the joint firm
Tuesday 18th March 2014
The compact XLamp XB-H III-nitride based LED is claimed to deliver excellent lumen density and optical control
Monday 17th March 2014
The company's new MAAP-011106 E-band power amplifier is ideally suited for small cell wireless backhaul infrastructure, enabling data gher to accommodate surging data demand
Monday 17th March 2014
The power electronics executive will head up the global commercialisation of the company’s gallium nitride power semiconductors
Monday 17th March 2014
As computer chips become smaller and smaller, advanced production techniques, such as Atomic Layer Deposition (ALD) have become more important for depositing thin layers of material.
Monday 17th March 2014
The new devices include PQFN-packaging and smaller die sizes targeting smaller, low-power applications
Monday 17th March 2014
This is estimated by MarketsandMarkets which analysed different sectors including the CdTe, CIGS and CIS solar cell sectors
Thursday 13th March 2014
The new III-V based devices will enable data transmission for supercomputers high capacity servers and data centres
Thursday 13th March 2014
The firm's tetrapod quantum dots could be integrated into LANL's 'Thick-Shell' technology. The aim is to develop a line of devices for displays and lighting units to enhance performance and life expectancy
Wednesday 12th March 2014
The firm's latest gallium nitride 'Spatium' devices can be used for airborne wireless and defence applications
Tuesday 11th March 2014
Windstream operates a nationwide fibre and IP network covering 118,000 miles of fibre and twenty-seven data centre locations
Tuesday 11th March 2014
A new design and accessible price on dimmable 60-W EQ bulb offers consumers slimmer utility bills without compromising light quality
Tuesday 11th March 2014
Along with UCSB, IQE has grown 1.3μm InAs quantum dot lasers on silicon
Tuesday 11th March 2014
The firms aim to develop a new UVA LED technology and promote GaN on GaN growth
Monday 10th March 2014
In 2014, China’s LED die production revenues are anticipated to grow 36.6 percent and packaged LEDs will grow 14.8 percent
Monday 10th March 2014
The tool will be used for III-V laser production