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Industry News



Thursday 27th March 2014
The compact scale GaN-on-silicon package is claimed to reduce mounting area by 90 percent
Thursday 27th March 2014
all line-up of LED component solutions
Wednesday 26th March 2014
The gallium nitride on silicon dotLED is 0.2mm in height and designed for applications that demand low profile electronic components
Wednesday 26th March 2014
The III-V multijunction cells will be used for the SNC global navigation satellite system
Wednesday 26th March 2014
Si-Ge-C superlattice films enable efficient light absorption and emission across an extended wavelength range, from UV to MWIR
Tuesday 25th March 2014
The contract is aimed at the company transferring 0.14 µm gallium nitride technology and manufacturing on 6 inch wafers to produce air force millimetre wave devices
Monday 24th March 2014
The Tokyo based firm is offering gallium nitride MOCVD for deposition on sapphire substrates
Monday 24th March 2014
The Moapa Southern Paiute Solar project is the first utility-scale solar project on tribal land and will deliver much needed economic benefits to the Tribe and Nevada
Friday 21st March 2014
The new white III-nitride chip series implements a novel phosphor coating process
Friday 21st March 2014
35 presentations equipped delegates with a comprehensive overview of the compound semiconductor industry
Thursday 20th March 2014
The market analysts believe that the LED market will stick to GaN-on-sapphire
Thursday 20th March 2014
The manufacturer of compound semiconductor epitaxial wafers is increasing the ability to produce high volumes of 4-inch and 6-inch wafers for VCSELs, edge-emitting lasers, detectors and photovoltaics
Thursday 20th March 2014
The FluidJet metal liftoff system is claimed to eliminate device damage, while using 80 percent less chemical than current single wafer processing solutions
Wednesday 19th March 2014
The firm says its latest III-nitride based CoB LEDs offer twice the light from half the surface
Wednesday 19th March 2014
The high volume production of the wafers will be used in a variety of applications. These will include the mobile, defence and military, computing and medical sectors
Wednesday 19th March 2014
The SPECTOR-HT system is claimed to offer higher depostion rates than other tools
Wednesday 19th March 2014
The firm's total area efficiency cadmium-telluride module has been confirmed by NREL. This result is expected to expand the opportunity for constrained space and C&I installations
Wednesday 19th March 2014
The firms' combined expertise is aimed at improving PV plant production and reduce costs in 1500VDC applications
Tuesday 18th March 2014
The combination will increase defence market opportunities for the joint firm
Tuesday 18th March 2014
The compact XLamp XB-H III-nitride based LED is claimed to deliver excellent lumen density and optical control
Monday 17th March 2014
The company's new MAAP-011106 E-band power amplifier is ideally suited for small cell wireless backhaul infrastructure, enabling data gher to accommodate surging data demand
Monday 17th March 2014
The power electronics executive will head up the global commercialisation of the company’s gallium nitride power semiconductors
Monday 17th March 2014
As computer chips become smaller and smaller, advanced production techniques, such as Atomic Layer Deposition (ALD) have become more important for depositing thin layers of material.
Monday 17th March 2014
The new devices include PQFN-packaging and smaller die sizes targeting smaller, low-power applications