Info
Info
search:

< Page of 13987 >

Industry News


Tuesday 28th September 2010
Researchers from Ohio State University have found that adding manganese (Mn) to gallium arsenide (Gas) endows the material with magnetic properties. This could eventually enable integrated circuits to run on heat, rather than electricity.
Monday 27th September 2010
Technical session highlights include conferences on military applications, recent measurements taken of the Eyjafjallajökull volcano and a roundtable discussion on Optics and Photonics for Counterterrorism and Crime Fighting.
Monday 27th September 2010
One of China’s leading B2B search platforms Frbiz.com has predicted that the annual average compound growth rate will reach 38.8%, and the landscape lighting LED market scale's annual average CGR will reach 21.5%.
Monday 27th September 2010
The multi-university-industry consortium will focus on innovative basic research in the field of photonics including InP Photonic Integrated Circuit (PIC) technology.
Friday 24th September 2010
The cooperative research and development agreement relating to compound semiconductor reliability measurements will allow technology transfer between the two organizations.
Friday 24th September 2010
Strategy Analytics latest report, “Terrestrial Military Satcom Platforms - Advanced Electronics Component Forecast”, predicts that the Radio Electronics Market will be $85 Million in 2010.
Friday 24th September 2010
The firm expects its development efforts on ultrahigh-speed optical and electrical components are expected to lead to new standards in optical communication systems in the next two years.
Friday 24th September 2010
Under the agreement, Viper RF will offer design support and specialized RF expertise to help customers develop chips using TriQuint's process technologies and design tools.
Thursday 23rd September 2010
The Taiwanese based firm has ordered six 55x2-inch Aixtron New Generation CRIUS II MOCVD growth tools to manufacture blue and green GaN LED wafers.
Thursday 23rd September 2010
The firm has recently signed a new distributor agreement with Midoriya Electric which distributes various electric and electronic products including semiconductors.
Thursday 23rd September 2010
The firm’s latest TQP15 technology will enable cost effective millimeter wave MMICs for use in applications such as VSAT, satellite communications and point to point radios.
Thursday 23rd September 2010
According to Research & Markets’ latest report, GaN and SiGe will overtake the GaAs MMIC sector while InP and InGaP demand in MMICs will dwindle.
Thursday 23rd September 2010
The firm’s Acriche LEDs will be used at Oak Ridge Laboratories’ housing project. Data from house outfitted Acriche LEDs will be compared with that of a house using compact fluorescent lights to demonstrate LEDs’ efficiency.
Thursday 23rd September 2010
The new product expands Dow Corning's product line beyond its existing offerings of 76 mm SiC and 100 mm SiC epitaxial wafers for high power applications.
Thursday 23rd September 2010
King Abdullah University of Science and Technology has selected EVG wafer bonding and automated alignment systems on the strength of flexible technology, local service and support.
Wednesday 22nd September 2010
The primary objective of the Phase 1 grant is to bring big-chip solid-state lighting solutions to world markets more rapidly and at lower costs with energy efficient electronics.
Wednesday 22nd September 2010
The two firms have agreed to share specific technologies regarding III-V compound semiconductor light emitting diodes (“LEDs”), which include InGaN LEDs and AlGaInP LEDs.
Wednesday 22nd September 2010
The wholly owned subsidiary has introduced a family of AlGaAs/InGaAs low noise pHEMT devices with operational frequencies to 26GHz.
Wednesday 22nd September 2010
The researchers have developed the necessary components needed to unlock the secrets of some of the world’s harshest environments. They are now working to integrate the modules into a device about the size of an iPhone.
Wednesday 22nd September 2010
The firm is the recipient of $5 Million in federal funding for its On-Chip integrated photonic polymer transceiver from the U.S. Senate Committee.
Tuesday 21st September 2010
The new production line will be located in Cree’s current Research Triangle Park facility and will enable larger LED wafers, increasing output and production efficiency.
Tuesday 21st September 2010
The lots include mass flow control technology and the use of AlN in thin-film structures for oxidation protection and electrical insulation.
Monday 20th September 2010
In an ongoing development program to increase the power of ultraviolet light emitting diodes (UV LEDs) operating in the germicidal wavelength range, Sensor Electronic Technology, Inc. (SETI) has again exceeded the record for maximum optical power out of a single chip device.
Monday 20th September 2010
CIP focusing on new energy-efficient photonic components for next-generation access and high-speed metro-core networks